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제품소개

PROCESS AUTOMATION SYSTEM

LOADER & UN LOADER FOR TC BONDER (FLIP CHIP BGA)

  • Applicable Substrate : Unit
  • Applicable Tools : Matrix Boat / Jig
  • Control : PC Control + Touch Monitor
  • Utility : AC 220V 50/60 HZ 3Phase / 7 BAR & ø 12 x 1ea
  • Server Communication : SECS GEM & RMS